3M™ Scotch-Weld™ Structural Adhesive Film AF 3109-2K .085wt High Tack, 48 in x 2 yds Sample, 1 per case
- 3M ID 7000046428
Details
Hoogtepunten
- Designed for 250°F (120°C) cure or 350°F (175°C)
- Adhesive can be cured from 225°F (107°C) up to 350°F (175°C)
- Excellent shop handling characteristics
- Excellent pre-bond humidity performance on composite substrates
- High-fracture toughness and peel strength
- Scotch-Weld AF 3109-2 can be used with 3M™ Scotch-Weld™ Structural Adhesive Primer EC-3960
- Improved resistance to high moisture pre-cure conditions
A thermosetting, modified epoxy structural adhesive film designed for bonding applications requiring high shear and peel strength at 250°F (121°C)
Specificaties
Hulpmiddelen
